Precision Processing > G2 Retainer Ring
G3 Retainer Ring
Product
  • Manufactured from high-strength engineering materials, it is utilized in CMP polishing processes to effectively secure wafer positioning and enhance process stability. It offers excellent wear resistance and long service life.
Application

The G3 polishing head is employed in the N65 to N14 processing of semiconductor

Contact
    Kuang Tien Plant- Jim Chen

    TEL:+886-6-702-9995 #66588
    Email: jimchen@wahhong.com