High Performance Material > Power Module Packaging Materials
Power Module Packaging Materials
Product

Power Module Packaging Materials

Feature
  • Power module packaging materials include a thermal conductive epoxy encapsulant that features high thermal conductivity, high heat resistance, a low expansion coefficient, and low viscosity.
Application

This Material is used in IGBT and MOSFET (600V-1200V) power modules, in high-speed, and high-voltage motor designs. Wahhong also provide packaging services for these products.

After curing Material exhibits excellent mechanical strength and superior electrical insulation. It is widely used to bond heating electronic products, heat sinks, or metal casings and can conceal customers high-tech IP and design.

Contact