Precise Coating Product > QFN Tape
QFN Tape
Product
  • Used in semiconductor molding processes to prevent resin leakage.
  • Designed to leave no adhesive residue and be heat-resistant, allowing easy peeling after processing.
Item PCT035QI-1 PCT035QI-2 PCT035QI-3 PCT035QI-4
Base Film PI PI PI PI
Base Film Thickness (um) 25 25 25 25
PSA type Silicone Silicone Silicone Silicone
PSA Adhesive Thickness (um) 10 10 10 10
Temperature(℃) 200 200 200 200
180° Peel Strength (g/25mm) [SUS] 20 40 50 75
CTE (ppm)[100-200℃] 19 19 19 19
PI/PEN Base Film Customization of base films available: PEN or PI
Adhesion: 5-1000g/25m
Silicone PSA
RF

Application

QFN package

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